Die Sawing
Product & Service – Semiconductor
Auto Die Mounting
Purpose:
To mount the wafer into a mylar tape and attach to metal frame.
Equipment Type:
- K&S ring
- Disco ring
- Wafer ranges from 2”, 3”, 4”, 5”, 6” & 8”
Manufacturing Capabilities:
- PCB Sawing
- Molded Package Sawing
- Ceramic Substrate Sawing
- PZT wafer sawing
- SiC , GaAs Wafer Sawing
- Electrical test on Vf, Vr and LOP
- 30x -100x wafer inspection
- Provide 100% Die Visual services
Die Sawing and Mounting
Purpose:
To singulate units from a wafer or substrate form.
Equipment Type:
Disco / TSK (Straight & Bevel Cut: Single/Dual Head Spindle / Laser Saw)
Manufacturing Capabilities:
- K&S ring and Disco ring
- Sawing conditions capabilities : DI Water resistivity with CO2 bubbler <1M or >10M, RO, H2O2, Triton-X & Diamaflow.
- Saw materials capability : Silicon, GaAs, Silicon Carbide, Copper wafers and Ceramic substrate, PCB.
LED Sawing Experiences
Purpose:
- We are able to perform Bevel Cut for special LED dies.
- Require additional breaking process
- Critical in control on un-cut depth (0.5mils) to prevent excessive chipping and double die during breaking
Criticalness Control on Un-cut Depth
- Tape thickness
- Table levelness
- Optimum setup parameter (Z height control)
Partial Sawing Experiences
- We are able to perform remount for broken wafer.
- We have SRU (Shape Recognize Unit) to define the shape of broken wafer to reduce the sawing time.
Substrate Sawing Experiences
Substrate Component
- Sawing on substrate contain of copper and encapsulant which having different co-efficient expansion.
Critical Criteria
- Copper frame burr and chipping
- Delam on transparent encapsulant
Criticalness Control on Sawing
- Optimum setup parameter (saw speed, define coolant angle, DI water flow rate)
- Chuck table levelness
- Selection of blade type (grit size, concentration range and exposure)
Side Braze Saw Experience
Sawing Concept :
- Engineering wafer to cut a structure out for assembly and testing.
Criticalness Control on Sawing
- Understand saw plan and manually program performing sawing.
Capabilities:
- Wafer thickness: thinnest down to 50 micron (2 mils)
- Saw street: as small as 0.8 mils
Sawing conditions capabilities:
- DI Water resistivity with CO2 bubbler <1M or >10M, RO, H2O2, Triton-X and Diamaflow.
Saw materials capabilities:
- Silicon, GaAs, Silicon Carbide, Copper wafers, Ceramic substrate and PCB.
Wastewater treatment capabilities:
| Capacity | 60 gpm |
| System Treatment | Treatment Plant rinse water from Plating Bath, Sawing & Scrubber Wafer materials : Silicon, GaAS, InGaN, Silicon Carbite. |
| Concentrate Areas | Die and substrate Sawing STM Tin Plate & IDT Lines (Pump < 3,200litres/Month) |
| Operation | 24hrs/day |
Effluent Parameters:
To comply with Malaysian Environment Quality Act 1974 Standard B for the below parameters.
| Parameter | Unit | Limit For STD B |
| pH | 5.5 – 9.0 | |
| BOD | mg/I | 50 |
| COD | mg/I | 100 |
| Suspended | Solids | 100 |
| Tin | mg/I | 1.0 |
| Lead | mg/I | 0.5 |
| Nikel | mg/I | 1.0 |
| Copper | mg/I | 1.0 |
| Oil & Grease | mg/I | 10.0 |