Auto Die Sorting
Product & Service – Semiconductor
Purpose:
To sort the die into the bin block to categorize the die spec.
Equipment Type:
- ASM 896 / 899DL
- BESI Laurier
Compatibility:
- Wafer size 8″ capability.
- Die size – as small as 7.0 mils x 7.0 mils to 80 miles x 80 mils
- XY accuracy – ±1.5mils
- q – ± 3°
- Sorted onto bin block or wafer tape
- Bin range from 8 to 100 bins