Auto Die Attach
Product & Service – Semiconductor
Purpose:
To attach die onto PCB/Substrate.
Manufacturing Capabilities:
- PCB/Substrate 8″ capability
- Wafer size 8″ capability
- Die Size-as small as 0.320mm x 0.320mm
- XY placement accuracy: +/-10um on every units with reference to a common Global Alignment Mark
- In line UV cure