Auto Pure Tin
Product & Service – Semiconductor
Purpose:
To tin plate the lead for better conductivity and avoid oxidation.
Equipment Type:
AEM, TECHNIC, PAL and STS
Chemistry:
100% Pure Tin, 100% Pure tin with Nickel under layer and Tin Bismuth process.
Compatibility:
- Pure tin plate for 2 lds to 28lds, 32lds, 40lds and 42lds Cerdip and Plastic molded packages.
- Fully automated. Loader from tube and reloaded into tube after plating process.
- Automatic Strip to Strip plating.
- Automatic Rack plating.
- Plating Thickness from 200u” to 800 u”
- CPK at 1.67
- Lead Frame width from 15mm to 60mm
Lead Frame Material (Base Metal):
- Finished product plating on Copper, AL42 and Silver Plated Lead Frame
Plating Location:
- Penang and Kuala Lumpur.