Purpose: 

• Is the primary method of making interconnections between an integrated circuit (IC) / LED and a printed circuit board (PCB) during semiconductor device assembly.   
• Stud Bump capability.

Manufacturing Capabilities:

• Pitch Capability
  • 60 μm in-line at +/- 3 sigma, standard
  • 50 μm in-line at +/- 3 sigma, at lower speed
• Total Bond Placement Accuracy
  • +/- 3.5 μm at 3 sigma
• Wafer/PCB Sizes
  • 50 mm to 300 mm Manual Wafer Chuck
  • 100 mm to 300 mm Automatic Wafer Chuck with Robotic Handling System (optional)