Purpose:

To tin plate the lead for better conductivity and avoid oxidation.

Equipment Type:

AEM, TECHNIC, PAL and STS

Chemistry:

100% Pure Tin, 100% Pure tin with Nickel under layer and Tin Bismuth process.

Compatibility:

Rack Plating	Strip to Strip Plating

• Pure tin plate for 2 lds to 28lds, 32lds, 40lds and 42lds Cerdip and Plastic molded packages.
• Fully automated. Loader from tube and reloaded into tube after plating process.
• Automatic Strip to Strip plating.
• Automatic Rack plating.
• Plating Thickness from 200u”  to 800 u”
• CPK at 1.67
• Lead Frame width from 15mm to 60mm

Lead Frame Material (Base Metal):

Finished product plating on Copper, AL42  and Silver Plated Lead Frame

Plating Location:

Penang and Kuala Lumpur.