Products & Services -
Semiconductor
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Purpose:
- Is the primary method of making interconnections between an integrated circuit (IC) / LED and a printed circuit board (PCB) during semiconductor device assembly.
- Stud Bump capability.
Manufacturing Capabilities:
- Pitch Capability
- 60 μm in-line at +/- 3 sigma, standard
- 50 μm in-line at +/- 3 sigma, at lower speed
- Total Bond Placement Accuracy
- Wafer/PCB Sizes
- 50 mm to 300 mm Manual Wafer Chuck
- 100 mm to 300 mm Automatic Wafer Chuck with Robotic Handling System (optional)
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