Auto Die Attach Print E-mail
Products & Services - Semiconductor


auto_die_ attach1             



To attach die onto PCB/Substrate. 

Manufacturing Capabilities:

  • PCB/Substrate 8" capability
  • Wafer size 8" capability
  • Die Size-as small as 0.320mm x 0.320mm
  • XY placement accuracy: +/-10um on every units with reference to a common Global Alignment Mark
  • In line UV cure