Purpose:

To mount the wafer into a mylar tape and attach to metal frame.

Equipment Type:

• K&S ring
• Disco ring
• Wafer ranges from 2”, 3”, 4”, 5”, 6” & 8”

Manufacturing Capabilities:

• PCB Sawing
• Molded Package Sawing
• Ceramic Substrate Sawing
• PZT wafer sawing
• SiC , GaAs Wafer Sawing
• Electrical test  on Vf, Vr and LOP
• 30x -100x  wafer  inspection
• Provide 100% Die Visual services

Purpose:

To singulate units from a wafer or substrate form.

Equipment Type:

Disco / TSK (Straight & Bevel Cut: Single/Dual Head Spindle / Laser Saw)

Manufacturing Capabilities:

• K&S ring and Disco ring
• Wafer Thickness from 0.05mm to 0.32mm
• Saw street: as small as 0.02mm to 0.074mm
• Spindle speed : 65k rpm
• Die size – as small as 0.178mm x 0.178mm to 2.30mm x 2.03mm
• Wafer size 50mm to 203mm
• Qty per wafer : up 55k dies / wafer (11 hrs sawing)
• Sawing conditions capabilities : DI Water resistivity with CO2 bubbler <1M or >10M, RO, H2O2, Triton-X & Diamaflow.
• Saw materials capability : Silicon, GaAs, Silicon Carbide, Copper wafers and Ceramic substrate, PCB.

• We are able to perform Bevel Cut for special LED dies.
• Require additional breaking process
• Critical in control on un-cut depth (0.5mils) to prevent excessive chipping and double die during breaking

Criticalness Control on Un-cut Depth

• Tape thickness
• Table levelness
• Optimum setup parameter (Z height control)

• We are able to perform remount for broken wafer.
• We have SRU (Shape Recognize Unit) to define the shape of broken wafer to reduce the sawing time.