IC Assembly/Test Services Manufacturing Capabilities
We are a full-fledged IC contract manufacturer, specializing in Ceramic, Cerdip packages, PCB and RF assembly and Tape & Reel services. Our Assembly/Test facilities support Military/Automotive/Commercial requirements.

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  Sophisticated and High-Tech Wafer Sawing Facility
    Wafer handling capability up to 8 inches wafer diameter
   

Supported by a Dual Stage Ultra-pure DI Water Plant with on-line monitoring features

    Utilizing high pressure wafer wash system
 
 
  Fully Automated Front-Of-Line Assembly
    Class 100 and Class 10K clean room facilities
    Fully automatic die attach equipment; ESEC, Alphasem, ASM
    Fully automatic wire bond equipment; KNS, ASM